Most of the products that we have designed incorporate some thermal management solutions. With the high power densities, especially at the board level, of today's electronics, thermal management must be considered up-front in the design cycle. By doing this, we are able to provide our customers with well-engineered, reliable and cost-effective products.

     LSI Engineering uses various thermal analysis software tools as well as manual analysis techniques for design and problem solving. Some of the products incorporating our thermal design solutions are listed below.

• Power Supplies
• Shipboard and Airborne Radar Transmitters
• Microelectronics Chassis
• Wafer Test Head
• Airborne Power Distribution Unit
• VXI Chassis Electronics Module
• Brazed and Bonded Fin Heat Exchangers
• Synthesizer Equipment Rack